被加工件最大厚度：40mm
被加工件最大直径：φ470mm
机器重量：约9000kg
本机器主要用于硅片、砷化镓片、陶瓷片、石英晶体及其它半导体材料的双面高精度研磨或抛光，也适用于其它金属、非金属、光学玻璃等硬、脆、薄材料的双面高精度研磨或抛光。
The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials.